再次突破｜Design and Performance Analysis of High-Precision Infra
经过同行专家评审，我团队投递的论文《Design and Performance Analysis of High-Precision Infrared Temperature Measurement Device Based on Butterworth Filter for Laser Soft Soldering》已被第五届IEEE智能控制、测量与信号处理国际学术会议 (IEEE-ICMSP 2023)收录且在IEEE上发表，并提交至IEEEXplore、EI Compendex、Scopus。这是我团队坚持在激光锡焊专业领域刻苦钻研，努力攻克一个又一个疑难问题的有力佐证。恭喜我们团队，恭喜武汉松尔德科技。
